As a typical representative of the high-precision manufacturing industry, the chip manufacturing industry widely adopts various automation machines to improve production efficiency and quality. Among these automation machines, slip rings play an important role as essential electrical connection devices. JINPAT, as a leading international slip ring manufacturer, provides corresponding slip ring solutions for key processes and equipment in wafer fabrication, chip etching, and packaging.
Let’s first look at the slip ring cases provided by JINPAT for packaging equipment. These cases cover highly complex multi-module products as well as seemingly ordinary standard products. One representative example is the LPS separate standard slip ring. These slip ring products have no bearings or casings, and the stat or brush wires and rotors are exposed. The standard products of the LPS separate slip rings support a 2A current throughout the series and are designed with gold-to-gold contact points, enabling mixed transmission of signals and current. In precision chip packaging equipment, the most commonly used model of the LPS separate slip rings is the LPS-12, which is responsible for 360° power transmission within the machine and does not involve signal transmission issues.
Due to their small size, LPS series slip rings are primarily suitable for small-scale electromechanical devices, and the chip manufacturing industry is no exception. For large-scale packaging equipment, slip ring solutions with more functions and stronger signal and current transmission capabilities need to be chosen. In general, hollow shaft slip rings and customized multi-module products are commonly used in medium to large-scale electromechanical devices. The latest product developed by JINPAT,the LPT000-0802-02L-03A, is a multi-module slip ring integrated with gas,liquid, and electricity. It integrates 8 channels of 2A current, 2 channels of liquid transmission, and 3 channels of gas transmission, meeting the requirements for transmitting special liquids and gases in packaging equipment.
JINPAT slip ring solutions are widely used in the chip packaging industry, providing manufacturers with reliable electrical connections. Whether it is a small packaging machine or a large packaging equipment, JINPAT slip ring products meet their respective needs,ensuring the reliability of signal transmission, data collection, and power supply. By collaborating with JINPAT, the chip manufacturing industry can obtain high-quality slip ring solutions, driving the industry’s development and progress.
